Invention Grant
- Patent Title: Thermal interface materials and methods for making thereof
- Patent Title (中): 热界面材料及其制造方法
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Application No.: US12448833Application Date: 2008-01-09
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Publication No.: US08404768B2Publication Date: 2013-03-26
- Inventor: Ramamoorthy Ramasamy , Gregory W. Shaffer , Paulo Meneghetti
- Applicant: Ramamoorthy Ramasamy , Gregory W. Shaffer , Paulo Meneghetti
- Applicant Address: US NY Waterford
- Assignee: Momentive Performance Materials Inc.
- Current Assignee: Momentive Performance Materials Inc.
- Current Assignee Address: US NY Waterford
- Agent Joseph E. Waters
- International Application: PCT/US2008/000303 WO 20080109
- International Announcement: WO2008/085999 WO 20080717
- Main IPC: C08K3/00
- IPC: C08K3/00
Abstract:
A thermal interface material is constructed from a base matrix comprising a polymer and 5 to 90 wt. % of boron nitride filler having a platelet structure, wherein the platelet structure of the boron nitride particles are substantially aligned for the thermal interface material to have a bulk thermal conductivity of at least 1 W/mK.
Public/Granted literature
- US20100200801A1 THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THEREOF Public/Granted day:2010-08-12
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