Invention Grant
US08404769B2 Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
有权
制备含有半IPN复合热固性树脂的树脂清漆的方法,并且使用该树脂清漆的方法,用于印刷线路板,预浸料和覆金属层压板的树脂清漆
- Patent Title: Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
- Patent Title (中): 制备含有半IPN复合热固性树脂的树脂清漆的方法,并且使用该树脂清漆的方法,用于印刷线路板,预浸料和覆金属层压板的树脂清漆
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Application No.: US12596165Application Date: 2008-04-25
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Publication No.: US08404769B2Publication Date: 2013-03-26
- Inventor: Daisuke Fujimoto , Yasuyuki Mizuno , Kazutoshi Danjoubara , Hikari Murai
- Applicant: Daisuke Fujimoto , Yasuyuki Mizuno , Kazutoshi Danjoubara , Hikari Murai
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2007-116785 20070426
- International Application: PCT/JP2008/058010 WO 20080425
- International Announcement: WO2008/136373 WO 20081113
- Main IPC: C08K3/26
- IPC: C08K3/26 ; B32B15/08

Abstract:
Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.
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