Invention Grant
- Patent Title: Method for heat dissipation on semiconductor device
- Patent Title (中): 半导体器件散热方法
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Application No.: US10930590Application Date: 2004-08-31
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Publication No.: US08404960B2Publication Date: 2013-03-26
- Inventor: Zachary A. Prather , Steven E. Reder , Michael J. Berman
- Applicant: Zachary A. Prather , Steven E. Reder , Michael J. Berman
- Applicant Address: US CA San Jose
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA San Jose
- Agency: Clark Hill PLC
- Main IPC: H01L35/30
- IPC: H01L35/30 ; H01L23/34
Abstract:
A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.
Public/Granted literature
- US20060043582A1 Method for heat dissipation on semiconductor device Public/Granted day:2006-03-02
Information query
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