Invention Grant
- Patent Title: Keypad assembly and electronic device using the same
- Patent Title (中): 键盘组装和电子设备使用相同
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Application No.: US12915284Application Date: 2010-10-29
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Publication No.: US08404987B2Publication Date: 2013-03-26
- Inventor: Bin Dai
- Applicant: Bin Dai
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010278424 20100910
- Main IPC: H01H13/00
- IPC: H01H13/00

Abstract:
A keypad assembly includes a support member, a key switch, a keycap and a resilient member. The key switch is located on the support member, and includes a triggering portion. The keycap is fixed opposite to the triggering portion. The resilient member is fixed to the keycap. The support member and the key switch are located between the keycap and the resilient member. The resilient member is elastically deformed by resisting the support member when the key switch is not triggered, such that the keycap tightly contacts the triggering portion of the key switch.
Public/Granted literature
- US20120061223A1 KEYPAD ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2012-03-15
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