A system for deleting the edges from coated substrates (6) and for separating said substrates into individual modules along the edge-deleted strips, wherein a laser scanner (2) for edge deletion and a laser head (9) for separating the substrate are disposed on opposite surfaces of the substrate (6) and, depending on the machine direction, can be positioned relative to each other, and their movement can be jointly controlled in such a manner that the laser scanner (2), in the machine direction, is always disposed at a fixed distance in front of the laser head (9), with two directions that are perpendicular to each other, preferably each with alternating directions of movement being available as machine directions.