Invention Grant
- Patent Title: Laser processing apparatus
- Patent Title (中): 激光加工设备
-
Application No.: US12899757Application Date: 2010-10-07
-
Publication No.: US08404999B2Publication Date: 2013-03-26
- Inventor: Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
- Applicant: Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2009-235539 20091009
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/067

Abstract:
A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.
Public/Granted literature
- US20110084050A1 LASER PROCESSING APPARATUS Public/Granted day:2011-04-14
Information query
IPC分类: