Invention Grant
- Patent Title: Method for producing a series of through holes in a layer of material by means of a laser beam
- Patent Title (中): 用于通过激光束在材料层中产生一系列通孔的方法
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Application No.: US12547943Application Date: 2009-08-26
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Publication No.: US08405000B2Publication Date: 2013-03-26
- Inventor: Walter Lutze , Martin Griebel , Michael Nittner
- Applicant: Walter Lutze , Martin Griebel , Michael Nittner
- Applicant Address: DE Jena
- Assignee: Jenoptik Automatisierungstechnik GmbH
- Current Assignee: Jenoptik Automatisierungstechnik GmbH
- Current Assignee Address: DE Jena
- Agency: Duane Morris LLP
- Priority: DE102008047239 20080911
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
The present invention relates to the production of a series of holes in a layer of material, in particular to the production of a target rupture line in a first layer of an airbag cover. The radiation of a plasma that forms during the production of each hole is detected from the surface that is being machined. From the signal pattern derived, the time of the beginning of the signal and the time of the appearance of a falling edge that meets a predetermined edge criterion are detected and stored. The point in time at which the falling edge appears is a switching criterion for switching off the laser. The difference between the two points in time stored for each hole constitutes a quality criterion for the respective hole.
Public/Granted literature
- US20100059489A1 Method for Producing a Series of Through Holes in a Layer of Material By Means of a Laser Beam Public/Granted day:2010-03-11
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