A method embodiment for forming an imaging array includes providing a glass substrate having a top surface, forming a patterned conductive layer on the top surface of the glass substrate, and forming an insulating layer on the patterned conductive layer on a side of the patterned conductive layer opposite the glass substrate. The method can include providing a single crystal silicon substrate having an internal separation layer proximate a first surface of the single crystal silicon substrate. The single crystal silicon substrate is secured to the glass substrate such that the first surface of the single crystal silicon substrate corresponds to the insulating layer. The single crystal silicon substrate is separated at the internal separation layer to create an exposed surface opposite the first surface of the single crystal silicon substrate and an array including one or more photosensitive elements and/or readout elements is formed thereon.