Invention Grant
US08405204B2 Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure
有权
半导体封装采用封装主体冷却结构，采用冷却液，半导体封装组装具有半导体封装和冷却液循环结构
- Patent Title: Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure
- Patent Title (中): 半导体封装采用封装主体冷却结构，采用冷却液，半导体封装组装具有半导体封装和冷却液循环结构
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Application No.: US12274582Application Date: 2008-11-20
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Publication No.: US08405204B2Publication Date: 2013-03-26
- Inventor: Tsuyoshi Hasegawa
- Applicant: Tsuyoshi Hasegawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-240378 20060905
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A semiconductor package includes a main body having a semiconductor device accommodating portion accommodating a basic circuit including a semiconductor device, external connection terminal members protruding outside the main body, and a cooling structure reducing heat generated by the device from the main body. The cooling structure includes a coolant flowing portion including a coolant supply port to which coolant is supplied, a coolant moving space which is positioned adjacent to the accommodating portion and in which the coolant moves in a back side of the basic circuit of the accommodating portion, and a coolant discharge port which discharges the coolant from the moving space. The semiconductor package assembly includes a package support body which supports the package and which includes a coolant circulation structure supplying coolant to the flowing portion of the main body through the supply port and collecting the supplied coolant through the discharge port.
Public/Granted literature
- US20090072386A1 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY Public/Granted day:2009-03-19
Information query
IPC分类:
