Invention Grant
- Patent Title: Light-emitting component and its manufacturing method
- Patent Title (中): 发光元件及其制造方法
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Application No.: US12449738Application Date: 2008-02-15
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Publication No.: US08405318B2Publication Date: 2013-03-26
- Inventor: Michiru Hatakenaka , Takeyoshi Oba , Toshiharu Takayama , Shizuo Yamamoto
- Applicant: Michiru Hatakenaka , Takeyoshi Oba , Toshiharu Takayama , Shizuo Yamamoto
- Applicant Address: JP Nagano
- Assignee: Koa Corporation
- Current Assignee: Koa Corporation
- Current Assignee Address: JP Nagano
- Agency: Posz Law Group, PLC
- Priority: JP2007-048795 20070228; JP2007-048797 20070228; JP2007-048805 20070228
- International Application: PCT/JP2008/052569 WO 20080215
- International Announcement: WO2008/105245 WO 20080904
- Main IPC: H05B37/02
- IPC: H05B37/02

Abstract:
In a light emitting component, a resistor element is formed on the back surface of a substrate and its resistance value is adjusted to make the light intensity of a light emitting element (LED) in a predetermined range. A constant electric current circuit comprised of the resistor element and a transistor supplies the constant electric current to an LED, and the LED and the transistor are formed on a unit insulating substrate. In the case where the unit insulating substrate is rectangular in shape, one pair of opposite sides are x in length, the other pair of opposite sides are y in length and the ratio value of x/y is in the range of 1-1.25. Further, this light emitting component is provided with two resistor elements and both resistor elements are subjected to a resistor value adjustment.
Public/Granted literature
- US20100039044A1 LIGHT-EMITTING COMPONENT AND ITS MANUFACTURING METHOD Public/Granted day:2010-02-18
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