A microactuator element as an example of an electrical component is disposed on a metallic, electrically conductive plate member. A conductive resin member is disposed on a current-carrying part of the conductive plate member and a conduction part of the microactuator element. A thin porous plating layer of thickness 100 nm or less includes a large number of gold particles is formed in a region of a surface of the conductive plate member which covers the current-carrying part. The conductive resin member is secured to the conductive plate member through the thin porous gold plating layer and electrically connected to the conductive plate member.