Invention Grant
- Patent Title: Monolithic ceramic electronic component and mounting structure thereof
- Patent Title (中): 单片陶瓷电子部件及其安装结构
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Application No.: US13296262Application Date: 2011-11-15
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Publication No.: US08405954B2Publication Date: 2013-03-26
- Inventor: Seiji Koga , Yukio Sanada
- Applicant: Seiji Koga , Yukio Sanada
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-169782 20070627
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/228 ; H01G4/06

Abstract:
A monolithic ceramic electronic component includes a first internal electrode including a first region extending to a first end surface and having a relatively large dimension in a width direction and a second region located at the side closer to a front end than is the first region and having a relatively small dimension in a width direction, wherein d1>c1+ng (n represents a constant based on the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d1, the distance between first and second wraparound portions is g, and the distance between a front end of the second wraparound portion and the second end surface is c1.
Public/Granted literature
- US20120293908A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF Public/Granted day:2012-11-22
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