Invention Grant
- Patent Title: Keypad assembly and electronic device using the same
- Patent Title (中): 键盘组装和电子设备使用相同
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Application No.: US12953758Application Date: 2010-11-24
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Publication No.: US08405961B2Publication Date: 2013-03-26
- Inventor: Bin Dai
- Applicant: Bin Dai
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010251941 20100812
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01H13/14

Abstract:
A keypad assembly includes a keypad, a fixing bracket, and at least one fixing member. The fixing member fixes the keypad to the fixing bracket, and the fixing bracket includes two support portions, a fixing portion, two connecting portions and at least two resilient portions. The resilient portions interconnect the support portions and the fixing portions. Opposite ends of each connecting portion interconnect the two support portions, such that the two connecting portions and the two support portions cooperatively form a frame. The fixing portion is located on a middle portion of the frame. The keycap is fixed on the fixing portion. The resilient portions elastically deform to provide elastic restoring force to the keycap.
Public/Granted literature
- US20120039026A1 KEYPAD ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2012-02-16
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