Invention Grant
- Patent Title: Heat dissipation device and electronic device having same
- Patent Title (中): 散热装置及具有该散热装置的电子装置
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Application No.: US13096983Application Date: 2011-04-28
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Publication No.: US08405976B2Publication Date: 2013-03-26
- Inventor: Lei Liu , Ai-Ling He
- Applicant: Lei Liu , Ai-Ling He
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110070728 20110323
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat dissipation device includes a receiving body and a blower. The receiving body includes a recessed body. The recessed body includes a first sidewall, a second sidewall opposite to the first sidewall, and a bottom connecting the first sidewall to the second sidewall. The blower is arranged on the bottom. The blower includes a casing, an air supply pipeline communicating with the casing, and an air blocking plate between the casing and the air supply pipeline. Two opposite ends of the air blocking plate respectively contact with the first sidewall and the second sidewall, such that the recessed body is separated into a first recessed area and a second recessed area. The first recessed area receives the casing, and the second recessed area receives the air supply pipeline.
Public/Granted literature
- US20120241131A1 HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE HAVING SAME Public/Granted day:2012-09-27
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