Invention Grant
- Patent Title: Cooling system for electronic device and electronic device having same
- Patent Title (中): 电子设备冷却系统及其电子设备
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Application No.: US13011981Application Date: 2011-01-24
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Publication No.: US08405987B2Publication Date: 2013-03-26
- Inventor: Yu-Chia Lai
- Applicant: Yu-Chia Lai
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99140690A 20101125
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A cooling system includes a fan and an air conducting cover. The air conducting cover includes a first airflow channel and an opposite second airflow channel. The first airflow channel includes a first air inlet and an opposite first air outlet, the second airflow channel includes a second air inlet and an opposite second air outlet. The first air inlet and the second air inlet are both aligned with the fan.
Public/Granted literature
- US20120134113A1 COOLING SYSTEM FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE HAVING SAME Public/Granted day:2012-05-31
Information query
