Invention Grant
- Patent Title: Integrated circuit packaging system and method of manufacture thereof
- Patent Title (中): 集成电路封装系统及其制造方法
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Application No.: US12331341Application Date: 2008-12-09
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Publication No.: US08406004B2Publication Date: 2013-03-26
- Inventor: Reza Argenty Pagaila , Byung Tai Do , Linda Pei Ee Chua
- Applicant: Reza Argenty Pagaila , Byung Tai Do , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent John Yang
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent.
Public/Granted literature
- US20100142174A1 INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-06-10
Information query
