Invention Grant
US08406896B2 Multi-element contact assemblies for electrical stimulation systems and systems and methods of making and using
有权
用于电刺激系统和系统的多元件接触组件以及制造和使用方法
- Patent Title: Multi-element contact assemblies for electrical stimulation systems and systems and methods of making and using
- Patent Title (中): 用于电刺激系统和系统的多元件接触组件以及制造和使用方法
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Application No.: US12494077Application Date: 2009-06-29
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Publication No.: US08406896B2Publication Date: 2013-03-26
- Inventor: Matthew Lee McDonald , John Michael Barker
- Applicant: Matthew Lee McDonald , John Michael Barker
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Frommer Lawrence & Haug LLP
- Agent Patrick R. Turner
- Main IPC: A61N1/05
- IPC: A61N1/05

Abstract:
An implantable lead includes a lead body having a plurality of electrodes disposed on a distal end of the lead body, a plurality of terminals disposed on a proximal end of the lead body, and a plurality of conductors disposed along the lead body such that each conductor electrically couples at least one of the electrodes to at least one of the terminals. At least one of the electrodes or terminals includes a multi-element contact assembly. The multi-element contact assembly includes at least one conductive inner element and at least one conductive outer element disposed over the inner element. At least one of the plurality of conductors is electrically coupled to one of the multi-element contact assemblies such that the conductor is positioned against the at least one inner element. The at least one outer element includes a region that is in contact with the at least one inner element.
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