Invention Grant
- Patent Title: Two-dimensional multi-products multi-tools advanced process control
- Patent Title (中): 二维多产品多工具高级过程控制
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Application No.: US13033413Application Date: 2011-02-23
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Publication No.: US08406904B2Publication Date: 2013-03-26
- Inventor: Chih-Wei Hsu , Yen-Di Tsen , Jong-I Mou
- Applicant: Chih-Wei Hsu , Yen-Di Tsen , Jong-I Mou
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G05B13/02
- IPC: G05B13/02 ; G06F19/00

Abstract:
The present disclosure provides a method. The method includes gathering advanced process control (APC) data from a subset of available wafers and a subset of available processing chambers. The method includes establishing a matrix that contains a plurality of cells. The cells each correspond to one of the available wafers and one of the available processing chambers. The matrix is partially filled by populating cells for which the APC data has been gathered. The method includes determining a plurality of chamber-coverage-rate (CCR) parameters associated with the matrix. The method includes optimizing the CCR parameters through an iteration process to obtain optimized CCR parameters. The method includes predicting an APC data value for a designated cell of the matrix based on the optimized CCR parameters. The designated cell is an empty cell before the predicting and is populated by the predicting.
Public/Granted literature
- US20120215337A1 TWO-DIMENSIONAL MULTI-PRODUCTS MULTI-TOOLS ADVANCED PROCESS CONTROL Public/Granted day:2012-08-23
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