Invention Grant
US08408221B2 Micro bubble generating device and silicon wafer cleaning apparatus 有权
微泡发生装置和硅晶片清洗装置

  • Patent Title: Micro bubble generating device and silicon wafer cleaning apparatus
  • Patent Title (中): 微泡发生装置和硅晶片清洗装置
  • Application No.: US12633914
    Application Date: 2009-12-09
  • Publication No.: US08408221B2
    Publication Date: 2013-04-02
  • Inventor: Teruo Haibara
  • Applicant: Teruo Haibara
  • Applicant Address: DE Munich
  • Assignee: Siltronic AG
  • Current Assignee: Siltronic AG
  • Current Assignee Address: DE Munich
  • Agency: Brooks Kushman P.C.
  • Priority: JP2008-330560 20081225
  • Main IPC: B08B3/12
  • IPC: B08B3/12
Micro bubble generating device and silicon wafer cleaning apparatus
Abstract:
A micro-bubble generating device is provided with a micro-bubble generating mechanism and a leading conduit provided with a widening section and a tube part, the widening section and the tube part in communication with each other in the leading conduit. The widening section has a hollow shape which has an axis Z as a central axis, and has base surfaces and a peripheral surface, and communicates with a nozzle of the micro-bubble-generating mechanism via one base surface of the widening section, and communicates with the tube part via the other base surface. The cross section orthogonal to a flow axis Z of the micro-bubbles of the widening section is larger than the cross section orthogonal to the flow axis Z of the tube part.
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