Invention Grant
- Patent Title: Micro bubble generating device and silicon wafer cleaning apparatus
- Patent Title (中): 微泡发生装置和硅晶片清洗装置
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Application No.: US12633914Application Date: 2009-12-09
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Publication No.: US08408221B2Publication Date: 2013-04-02
- Inventor: Teruo Haibara
- Applicant: Teruo Haibara
- Applicant Address: DE Munich
- Assignee: Siltronic AG
- Current Assignee: Siltronic AG
- Current Assignee Address: DE Munich
- Agency: Brooks Kushman P.C.
- Priority: JP2008-330560 20081225
- Main IPC: B08B3/12
- IPC: B08B3/12

Abstract:
A micro-bubble generating device is provided with a micro-bubble generating mechanism and a leading conduit provided with a widening section and a tube part, the widening section and the tube part in communication with each other in the leading conduit. The widening section has a hollow shape which has an axis Z as a central axis, and has base surfaces and a peripheral surface, and communicates with a nozzle of the micro-bubble-generating mechanism via one base surface of the widening section, and communicates with the tube part via the other base surface. The cross section orthogonal to a flow axis Z of the micro-bubbles of the widening section is larger than the cross section orthogonal to the flow axis Z of the tube part.
Public/Granted literature
- US20100163084A1 Micro Bubble Generating Device and Silicon Wafer Cleaning Apparatus Public/Granted day:2010-07-01
Information query
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