Invention Grant
- Patent Title: Vacuum lamination device
- Patent Title (中): 真空层压装置
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Application No.: US11723026Application Date: 2007-03-16
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Publication No.: US08408263B2Publication Date: 2013-04-02
- Inventor: Yasuhiro Yokoyama
- Applicant: Yasuhiro Yokoyama
- Applicant Address: JP Tokyo
- Assignee: Fuji Electric Holding Co., Ltd.
- Current Assignee: Fuji Electric Holding Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP2003-400937 20031201
- Main IPC: B32B37/10
- IPC: B32B37/10

Abstract:
A vacuum lamination device for laminating a lamination member includes a base plate having an uneven surface contacting the lamination member for placing the lamination member, a frame member fixed to the base plate and having a discharge port for evacuating a processing space, and a cover member for hermetically sealing the processing space in the lamination process. The lamination member is placed on the uneven surface, and the cover member is placed so as to cover the lamination member. Then, a gaseous material in the processing space is evacuated through the discharge port while heating the processing space.
Public/Granted literature
- US20070151670A1 Vacuum lamination device Public/Granted day:2007-07-05
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