Invention Grant
- Patent Title: Heat dissipation apparatus
- Patent Title (中): 散热装置
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Application No.: US12775498Application Date: 2010-05-07
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Publication No.: US08408285B2Publication Date: 2013-04-02
- Inventor: Zhi-Sheng Lian , Gen-Ping Deng
- Applicant: Zhi-Sheng Lian , Gen-Ping Deng
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910310022 20091119
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom.
Public/Granted literature
- US20110114301A1 HEAT DISSIPATION APPARATUS AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-05-19
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