Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US13163755Application Date: 2011-06-20
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Publication No.: US08408662B2Publication Date: 2013-04-02
- Inventor: Liang-Chin Wang , Jian Hu , Yu-Ming Xiao , Zan Li
- Applicant: Liang-Chin Wang , Jian Hu , Yu-Ming Xiao , Zan Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010509997 20101015
- Main IPC: A47B81/00
- IPC: A47B81/00 ; H01R13/66

Abstract:
An electronic device enclosure comprises a securing plate and a bracket adapted to receive an I/O connector therein. The bracket comprises a first resilient piece, a second resilient piece, a first retaining piece and a second retaining piece. The bracket is capable of securing to the front wall in a first position, where the first resilient piece and the first retaining piece abut two opposite surfaces of the securing plate, and a second position, where the second resilient piece and the second retaining piece abut the two opposite surfaces of the securing plate.
Public/Granted literature
- US20120091868A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2012-04-19
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