Invention Grant
- Patent Title: Integrated connector
- Patent Title (中): 集成连接器
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Application No.: US13364632Application Date: 2012-02-02
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Publication No.: US08408940B2Publication Date: 2013-04-02
- Inventor: Nai-Chien Chang
- Applicant: Nai-Chien Chang
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: TW100205463U 20110328
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
The integrated connector includes an insulative body, a circuit board, eSATA interface bonding fingers, USB interface bonding fingers and USB pins. The insulative body has a trough towards a front side thereof and a plate under the trough. The plate is towards the front side of the insulative body and is formed with first openings and second openings behind the first openings. The circuit board is disposed in the trough and has a first conductive side and a second conductive side. The eSATA interface bonding fingers are disposed on the first conductive side. The USB interface bonding fingers are disposed on the second conductive side and exposed by the first openings. The USB pins are disposed in the trough and under the circuit. Each of the USB pins has a contact portion and a solder portion. The contact portions protrude from the insulative body through the second openings.
Public/Granted literature
- US20120252245A1 INTEGRATED CONNECTOR Public/Granted day:2012-10-04
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