Invention Grant
- Patent Title: Apparatus and method for intricate cuts
- Patent Title (中): 复杂切割的装置和方法
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Application No.: US12692837Application Date: 2010-01-25
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Publication No.: US08408972B2Publication Date: 2013-04-02
- Inventor: Kevin M. Kenney
- Applicant: Kevin M. Kenney
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: B24B1/00
- IPC: B24B1/00

Abstract:
Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless.
Public/Granted literature
- US20110183580A1 APPARATUS AND METHOD FOR INTRICATE CUTS Public/Granted day:2011-07-28
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