Invention Grant
US08409457B2 Methods of forming a photoresist-comprising pattern on a substrate
有权
在基板上形成含光致抗蚀剂的图案的方法
- Patent Title: Methods of forming a photoresist-comprising pattern on a substrate
- Patent Title (中): 在基板上形成含光致抗蚀剂的图案的方法
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Application No.: US12201744Application Date: 2008-08-29
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Publication No.: US08409457B2Publication Date: 2013-04-02
- Inventor: Zishu Zhang , Hongbin Zhu , Anton deVilliers , Alex Schrinsky
- Applicant: Zishu Zhang , Hongbin Zhu , Anton deVilliers , Alex Schrinsky
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: C03C15/00
- IPC: C03C15/00

Abstract:
A method of forming a photoresist-comprising pattern on a substrate includes forming a patterned first photoresist having spaced first masking shields in at least one cross section over a substrate. The first masking shields are exposed to a fluorine-containing plasma effective to form a hydrogen and fluorine-containing organic polymer coating about outermost surfaces of the first masking shields. A second photoresist is deposited over and in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating. The second photoresist which is in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating is exposed to a pattern of actinic energy and thereafter spaced second masking shields are formed in the one cross section which comprise the second photoresist and correspond to the actinic energy pattern. The first and second masking shields together form at least a part of a photoresist-comprising pattern on the substrate. Other embodiments are disclosed.
Public/Granted literature
- US20100055913A1 Methods Of Forming A Photoresist-Comprising Pattern On A Substrate Public/Granted day:2010-03-04
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