Invention Grant
US08409781B2 Composition for formation of resist protection film, and method for formation of resist pattern using the same
有权
用于形成抗蚀剂保护膜的组合物，以及使用其形成抗蚀剂图案的方法
- Patent Title: Composition for formation of resist protection film, and method for formation of resist pattern using the same
- Patent Title (中): 用于形成抗蚀剂保护膜的组合物，以及使用其形成抗蚀剂图案的方法
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Application No.: US12440784Application Date: 2007-09-14
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Publication No.: US08409781B2Publication Date: 2013-04-02
- Inventor: Keita Ishiduka , Toshikazu Takayama
- Applicant: Keita Ishiduka , Toshikazu Takayama
- Applicant Address: JP Kanagawa
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Hoffmann & Baron, LLP
- Priority: JP2006-254469 20060920
- International Application: PCT/JP2007/067987 WO 20070914
- International Announcement: WO2008/035641 WO 20080327
- Main IPC: G03C1/00
- IPC: G03C1/00 ; G03F7/00
Abstract:
Disclosed are: a composition for forming a resist protection film, which shows less damage to a resist film, can form a good, rectangular resist pattern, and can be used regardless of the structure of a resin used in a resist composition; and a method for forming a resist pattern by using the composition. Specifically, disclosed are: a composition for forming a resist protection film, which comprises (a) an alkali-soluble polymer and (b) an ether-based solvent; and a method for forming a resist pattern by using the composition.
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