Invention Grant
- Patent Title: Delamination and crack resistant image sensor structures and methods
- Patent Title (中): 分层和抗裂图像传感器的结构和方法
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Application No.: US13025681Application Date: 2011-02-11
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Publication No.: US08409899B2Publication Date: 2013-04-02
- Inventor: Jeffrey P. Gambino , Mark D. Jaffe , Robert K. Leidy , Charles F. Musante , Richard J. Rassel
- Applicant: Jeffrey P. Gambino , Mark D. Jaffe , Robert K. Leidy , Charles F. Musante , Richard J. Rassel
- Applicant Address: US NY Armonk
- Assignee: Intnernational Business Machines Corporation
- Current Assignee: Intnernational Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C
- Agent Anthony J. Canale
- Main IPC: H01L29/72
- IPC: H01L29/72
Abstract:
A plurality of image sensor structures and a plurality of methods for fabricating the plurality of image sensor structures provide for inhibited cracking and delamination of a lens capping layer with respect to a planarizing layer within the plurality of image sensor structures. Particular image sensor structures and related methods include at least one dummy lens layer of different dimensions than active lens layer located over a circuitry portion of a substrate within the particular image sensor structures. Additional particular image sensor structures include at least one of an aperture within the planarizing layer and a sloped endwall of the planarizing layer located over a circuitry portion within the particular image sensor structures.
Public/Granted literature
- US20110129955A1 DELAMINATION AND CRACK RESISTANT IMAGE SENSOR STRUCTURES AND METHODS Public/Granted day:2011-06-02
Information query
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