Invention Grant
- Patent Title: Integrated circuit package system for package stacking and method of manufacture therefor
- Patent Title (中): 用于封装堆叠的集成电路封装系统及其制造方法
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Application No.: US12057360Application Date: 2008-03-27
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Publication No.: US08409920B2Publication Date: 2013-04-02
- Inventor: Rajendra D. Pendse , Flynn Carson , Il Kwon Shim , Seng Guan Chow
- Applicant: Rajendra D. Pendse , Flynn Carson , Il Kwon Shim , Seng Guan Chow
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An integrated circuit package system and method of manufacture therefor includes: forming an area array substrate; mounting surface conductors on the area array substrate; forming a molded package body on the area array substrate and the surface conductors; providing a step in the molded package body; and exposing a surface conductor by the step.
Public/Granted literature
- US20080258289A1 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING Public/Granted day:2008-10-23
Information query
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