Invention Grant
- Patent Title: Integrated multicomponent device in a semiconducting die
- Patent Title (中): 半导体模具中集成的多组分器件
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Application No.: US12602846Application Date: 2008-06-05
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Publication No.: US08409971B2Publication Date: 2013-04-02
- Inventor: Jean-Charles Souriau , Francois Baleras
- Applicant: Jean-Charles Souriau , Francois Baleras
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0755575 20070607
- International Application: PCT/EP2008/057002 WO 20080605
- International Announcement: WO2008/155231 WO 20081224
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495
Abstract:
An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.
Public/Granted literature
- US20100195299A1 Integrated multicomponent device in a semiconducting die Public/Granted day:2010-08-05
Information query
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