Objects are to reduce the number of steps in a process for separating a substrate and a semiconductor element, to provide a separation apparatus capable of reducing the number of steps, to suppress manufacturing cost by reducing the number of steps in a separation process, and to improve productivity in manufacturing semiconductor elements. A separation apparatus including a frame body, a porous body having a chamfered, rounded corner portion, a suction unit configured to create suction in the porous body and the frame body, and a jig which includes a unit adopted to press down part of an object to be separated and a unit adopted to lift another part of the object to be separated, and also a separation method and a method for manufacturing a semiconductor element by using the separation apparatus, are provided.