Invention Grant
- Patent Title: Underfill flow guide structures and method of using same
- Patent Title (中): 底部填充流动导向结构及其使用方法
-
Application No.: US13347087Application Date: 2012-01-10
-
Publication No.: US08409980B2Publication Date: 2013-04-02
- Inventor: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Marie-Claude Paquet , Wolfgang Sauter , Timothy D. Sullivan
- Applicant: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Marie-Claude Paquet , Wolfgang Sauter , Timothy D. Sullivan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Richard Kotulak
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Underfill flow guide structures and methods of using the same are provided with a module. The method includes mounting bumps on a substrate. The method also includes forming underfill flow guide structures on the substrate by patterning wires with an overlay of hard substance. The underfill flow guide structures are integrated with the substrate and formed between adjacent bumps. The underfill flow guide structures are further formed to uniformly guide underfill along the substrate during capillary underfill processing.
Public/Granted literature
- US20120108015A1 UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME Public/Granted day:2012-05-03
Information query
IPC分类:
