Invention Grant
- Patent Title: Chemical vapor deposition apparatus, film forming method, and method of manufacturing semiconductor device
- Patent Title (中): 化学气相沉积设备,成膜方法和制造半导体器件的方法
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Application No.: US12510608Application Date: 2009-07-28
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Publication No.: US08409983B2Publication Date: 2013-04-02
- Inventor: Hiroyuki Uesugi
- Applicant: Hiroyuki Uesugi
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
In forming a TiN film on a base material (10) by a MOCVD method, a space between a showerhead (3) and a trapping member (5) is heated by a heater (2) up to a temperature at which TDMAT is thermally decomposed, or higher. Next, source gas containing TDMAT, and so on are emitted from the showerhead (3) into a chamber (1). As a result, the TDMAT emitted into the chamber (1) is thermally decomposed into TiN, carbon, and hydrocarbon by the heater (2) in the space between the showerhead (3) and the trapping member (5). Then, the TiN, carbon, and hydrocarbon move toward the base material (10). Then, the carbon and hydrocarbon are trapped by the trapping member (5). On the other hand, the TiN passes through the trapping member (5) without being trapped to reach the base material (10). As a result, a TiN film containing neither carbon nor hydrocarbon grows on a surface of the base material (10).
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