Invention Grant
- Patent Title: Structure and method to fabricate a body contact
- Patent Title (中): 制造身体接触的结构和方法
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Application No.: US12944174Application Date: 2010-11-11
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Publication No.: US08409989B2Publication Date: 2013-04-02
- Inventor: Chengwen Pei , Roger Allen Booth, Jr. , Kangguo Cheng , Joseph Ervin , Ravi M. Todi , Geng Wang
- Applicant: Chengwen Pei , Roger Allen Booth, Jr. , Kangguo Cheng , Joseph Ervin , Ravi M. Todi , Geng Wang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Howard M. Cohn; Katherine S. Brown
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
A structure and method to fabricate a body contact on a transistor is disclosed. The method comprises forming a semiconductor structure with a transistor on a handle wafer. The structure is then inverted, and the handle wafer is removed. A silicided body contact is then formed on the transistor in the inverted position. The body contact may be connected to neighboring vias to connect the body contact to other structures or levels to form an integrated circuit.
Public/Granted literature
- US20120119310A1 STRUCTURE AND METHOD TO FABRICATE A BODY CONTACT Public/Granted day:2012-05-17
Information query
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