Invention Grant
- Patent Title: Skin wound healing compositions and methods of use thereof
- Patent Title (中): 皮肤伤口愈合组合物及其使用方法
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Application No.: US13210200Application Date: 2011-08-15
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Publication No.: US08410055B2Publication Date: 2013-04-02
- Inventor: Wei Li , Mei Chen , David T. Woodley
- Applicant: Wei Li , Mei Chen , David T. Woodley
- Applicant Address: US CA Los Angeles
- Assignee: University of Southern California
- Current Assignee: University of Southern California
- Current Assignee Address: US CA Los Angeles
- Agency: McDermott Will & Emery LLP
- Main IPC: A61K38/00
- IPC: A61K38/00 ; A61K45/00 ; A61P43/00

Abstract:
A wound healing composition comprising an amount of heat shock protein effective to promote wound healing and a method thereof to apply the composition. A preferred heat shock protein is either full-length hsp90α or the middle domain plus the charged sequence of hsp90α. The composition is topically applied to skin wounds, covering the outer surface of the wound. The heat shock protein acts by promoting migration of both human epidermal keratinocyte and dermal fibroblasts to the wound in order to close, heal, and remodel the wound.
Public/Granted literature
- US20110301090A1 SKIN WOUND HEALING COMPOSITIONS AND METHODS OF USE THEREOF Public/Granted day:2011-12-08
Information query
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