Invention Grant
- Patent Title: Polyvinylidene fluoride resin expanded beads, and molded articles of polyvinylidene fluoride resin expanded beads
- Patent Title (中): 聚偏二氟乙烯树脂发泡珠,聚偏氟乙烯树脂发泡珠的成型品
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Application No.: US13255213Application Date: 2010-03-05
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Publication No.: US08410187B2Publication Date: 2013-04-02
- Inventor: Masakazu Sakaguchi , Kouki Nishijima , Masaharu Oikawa
- Applicant: Masakazu Sakaguchi , Kouki Nishijima , Masaharu Oikawa
- Applicant Address: JP Tokyo
- Assignee: JSP Corporation
- Current Assignee: JSP Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-057134 20090310
- International Application: PCT/JP2010/001561 WO 20100305
- International Announcement: WO2010/103771 WO 20100916
- Main IPC: C08F14/22
- IPC: C08F14/22 ; C08F114/22 ; C08J9/08

Abstract:
Provided are polyvinylidene fluoride resin expanded beads which can be molded by in-mold molding and thus stably provide, without impairing excellent characteristics inherent in polyvinylidene fluoride resin, molded articles having excellent mechanical properties. Polyvinylidene fluoride resin expanded beads, characterized in that when 1 to 3 mg of the expanded beads are subjected to heat-flux type differential scanning calorimetry (DSC) wherein the beads are heated from 25° C. to 200° C. at a temperature rise rate of 10° C./min, the obtained DSC curve (of first heating) has both an inherent endothermic peak which is inherent in polyvinylidene fluoride resin and one or more higher-temperature endothermic peaks which appear on the higher-temperature side of the inherent endothermic peak, the quantity of heat of melting of the higher-temperature endothermic peaks being at least 0.5 J/g.
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