Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US12882598Application Date: 2010-09-15
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Publication No.: US08410358B2Publication Date: 2013-04-02
- Inventor: Yun-Lung Chen , Ling-Xin Zeng , Jun-Pu Li
- Applicant: Yun-Lung Chen , Ling-Xin Zeng , Jun-Pu Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010191584 20100604
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
An electronic device enclosure includes an enclosure body, a bezel, a resilient locking clip, and an unlocking clip. An opening is defined in the enclosure body. The bezel assembly is mounted to the enclosure body and covers the opening. The resilient locking clip is attached to the enclosure body. A protrusion is located on the resilient clip. The unlocking clip is attached to the bezel assembly and is operable along a first direction. The unlocking clip is capable of being rotated from a first position to a second position. In the first position, the resilient locking clip blocks the bezel assembly from moving along the first direction. In the second position, the resilient clip is disengaged from the bezel by the unlocking clip.
Public/Granted literature
- US20110297414A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2011-12-08
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