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Invention Grant
US08410360B2 Sealing structure for wire lead-out hole 有权
导线孔密封结构

Sealing structure for wire lead-out hole
Abstract:
A sealing structure for wire lead-out hole is provided with a wire lead-out hole (11) formed in a case (10), a resilient seal (20) to be mounted into the wire lead-out hole (11), and a bracket (40) for retaining the resilient seal (20) in the wire lead-out hole (11) by being fixed to the case (10). The resilient seal (20) includes a seal main body (21) including a plurality of wire insertion holes (22) for allowing insertion of wires (Y), outer lips (24) formed on the outer peripheral surface of the seal main body (21), inner lips (23) formed on the inner peripheral surfaces of the wire insertion holes (22), and a wire protecting portion (25) provided on the seal main body (21).
Abstract(Chinese):

导线孔的密封结构设置有形成在壳体（10）中的导线孔（11），安装在导线孔（11）中的弹性密封件（20），以及 用于通过固定到所述壳体（10）将所述弹性密封件（20）保持在所述导线孔（11）中的支架（40）。 弹性密封件（20）包括密封主体（21），其包括多个用于允许插入线（Y）的线插入孔（22），形成在密封主体的外周面上的外唇（24） 21），形成在电线插入孔（22）的内周面上的内唇（23）和设置在密封主体（21）上的线保护部（25）。

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