Invention Grant
- Patent Title: Printed wiring board
- Patent Title (中): 印刷电路板
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Application No.: US12582050Application Date: 2009-10-20
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Publication No.: US08410374B2Publication Date: 2013-04-02
- Inventor: Toru Furuta , Kotaro Takagi , Michio Ido , Fumitaka Takagi
- Applicant: Toru Furuta , Kotaro Takagi , Michio Ido , Fumitaka Takagi
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.
Public/Granted literature
- US20100218980A1 PRINTED WIRING BOARD Public/Granted day:2010-09-02
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