Invention Grant
- Patent Title: Switch structure on sidewall of circuit board for electronic device
- Patent Title (中): 电子设备电路板侧壁开关结构
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Application No.: US13481596Application Date: 2012-05-25
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Publication No.: US08410380B2Publication Date: 2013-04-02
- Inventor: Chih-Feng Yeh , Wen-Nan Hsia , Cheng-Ju Lee
- Applicant: Chih-Feng Yeh , Wen-Nan Hsia , Cheng-Ju Lee
- Applicant Address: TW Hsichih, Taipei Hsien
- Assignee: Wistron Corp.
- Current Assignee: Wistron Corp.
- Current Assignee Address: TW Hsichih, Taipei Hsien
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW98105445A 20090220
- Main IPC: H01H1/20
- IPC: H01H1/20

Abstract:
A switch structure on the sidewall of a circuit board for an electronic device and manufacturing methods of the circuit board are provided. The switch structure includes a circuit board, a plurality of conductive portions, and a movable unit. The conductive portions are formed on a sidewall of the circuit board and electrically insulated from each other. The movable unit is disposed corresponding to the conductive portions to electrically connect or disconnect the plurality of conductive portions to achieve the switch function. The switch structure utilizes the structural design of the circuit board to reduce the space on the circuit board preserved for a circuit board switch.
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