Invention Grant
- Patent Title: Keypad assembly and electronic device using the same
- Patent Title (中): 键盘组装和电子设备使用相同
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Application No.: US12915277Application Date: 2010-10-29
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Publication No.: US08410385B2Publication Date: 2013-04-02
- Inventor: Bin Dai
- Applicant: Bin Dai
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010278415 20100910
- Main IPC: H01H13/14
- IPC: H01H13/14
Abstract:
A keypad assembly includes a support member, a key switch, a keycap, and a resilient member. The key switch is fixed on the support member and includes a triggering portion. The keycap is located opposite to the triggering portion. The resilient member includes a rotation portion and a resilient support portion connected to the rotation portion. The rotation portion is rotatably connected to the keycap and the support member. The resilient support portion is elastically deformed via resisting the support member when the key switch is not triggered, and provides an elastic restoring force to the rotation portion.
Public/Granted literature
- US20120061221A1 KEYPAD ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2012-03-15
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