Invention Grant
- Patent Title: Machining device and method for machining material
- Patent Title (中): 加工材料加工装置及方法
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Application No.: US12594765Application Date: 2008-03-04
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Publication No.: US08410392B2Publication Date: 2013-04-02
- Inventor: Markus Kogel-Hollacher , Christoph Dietz
- Applicant: Markus Kogel-Hollacher , Christoph Dietz
- Applicant Address: DE Rodgau
- Assignee: Precitec Optronik GmbH
- Current Assignee: Precitec Optronik GmbH
- Current Assignee Address: DE Rodgau
- Agency: Lempia Summerfield Katz LLC
- Priority: DE102007016444 20070405; EP08001774 20080131
- International Application: PCT/EP2008/001692 WO 20080304
- International Announcement: WO2008/122330 WO 20081016
- Main IPC: B23K15/00
- IPC: B23K15/00 ; B23K26/02

Abstract:
The invention relates to a machining device (10) comprising at least one machining head (16) designed to provide at least one high-energy machining beam (22), especially an electron or laser beam. Such a machining device is used to remove material from workpieces (28) or for connecting workpieces (28) by bonding, especially by means of welding. According to the invention, at least one scanning device (32) designed as an optical coherence tomograph and provided for surface scanning is associated with the machining head (16). The invention also relates to a method for machining material using a high-energy machining beam for scanning surface areas of a workpiece which is machined, not yet machined, or being machined, by means of an optical coherence tomograph.
Public/Granted literature
- US20100155375A1 Machining Device and Method for Machining Material Public/Granted day:2010-06-24
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