Invention Grant
- Patent Title: Pattern defect inspection method and its apparatus
- Patent Title (中): 图案缺陷检查方法及其装置
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Application No.: US11785432Application Date: 2007-04-17
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Publication No.: US08410460B2Publication Date: 2013-04-02
- Inventor: Minoru Yoshida , Shunji Maeda , Hidetoshi Nishiyama , Masahiro Watanabe
- Applicant: Minoru Yoshida , Shunji Maeda , Hidetoshi Nishiyama , Masahiro Watanabe
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2003-020896 20030129
- Main IPC: G01J3/10
- IPC: G01J3/10

Abstract:
The pattern defect inspection apparatus and its method of the present invention comprises: a recipe setting unit for setting an inspection recipe and/or a review recipe; an illumination optical system including: a laser light source for emitting ultraviolet laser light; a quantity-of-light adjusting unit for adjusting a quantity of the ultraviolet laser light emitted from the laser light source; and an illumination range forming unit for forming on a sample an illumination range of the ultraviolet laser light; a coherence reducing system; and a detection optical system including: a condensing optical system; a diffracted-light control optical system; and a detecting unit.
Public/Granted literature
- US20070195316A1 Pattern defect inspection method and its apparatus Public/Granted day:2007-08-23
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