Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
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Application No.: US13141217Application Date: 2009-12-21
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Publication No.: US08410471B2Publication Date: 2013-04-02
- Inventor: Akihiko Murai
- Applicant: Akihiko Murai
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-326532 20081222
- International Application: PCT/JP2009/071239 WO 20091221
- International Announcement: WO2010/074028 WO 20100701
- Main IPC: H01L33/06
- IPC: H01L33/06

Abstract:
A light emitting device includes a substrate, and an LED chip mounted on the substrate. The chip includes: a body comprising a transparent conductor which comprises a base and sticks out of the base to taper off from the base; a light source comprising light emitting parts separately formed on the base; a first terminal formed on the base; and second terminals formed on the light emitting parts, respectively. A conductive pattern of the substrate includes: a first conductor electrically connected with the first terminal; and second conductors electrically connected with the second terminals, respectively.
Public/Granted literature
- US20110248239A1 LIGHT EMITTING DEVICE Public/Granted day:2011-10-13
Information query
IPC分类: