Invention Grant
- Patent Title: Epitaxial substrate for electronic device and method of producing the same
- Patent Title (中): 电子器件用外延基板及其制造方法
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Application No.: US13139428Application Date: 2009-12-14
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Publication No.: US08410472B2Publication Date: 2013-04-02
- Inventor: Tetsuya Ikuta , Jo Shimizu , Tomohiko Shibata
- Applicant: Tetsuya Ikuta , Jo Shimizu , Tomohiko Shibata
- Applicant Address: JP Tokyo
- Assignee: Dowa Electronics Materials Co., Ltd.
- Current Assignee: Dowa Electronics Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-318435 20081215; JP2009-036863 20090219; JP2009-280860 20091210
- International Application: PCT/JP2009/006840 WO 20091214
- International Announcement: WO2010/070863 WO 20100624
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
An epitaxial substrate for an electronic device having a Si single crystal substrate, a buffer as an insulating layer formed on the Si single crystal substrate, and a main laminated body formed by plural group III nitride layers epitaxially grown on the buffer, wherein a lateral direction of the epitaxial substrate is defined as an electric current conducting direction. The buffer including at least an initially grown layer in contact with the Si single crystal substrate and a superlattice laminate constituted of a superlattice multilayer structure on the initially grown layer.
Public/Granted literature
- US20110240962A1 EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE AND METHOD OF PRODUCING THE SAME Public/Granted day:2011-10-06
Information query
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