Invention Grant
- Patent Title: Method for manufacturing microcrystalline semiconductor film and method for manufacturing semiconductor device
- Patent Title (中): 微晶半导体膜的制造方法及半导体装置的制造方法
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Application No.: US13102386Application Date: 2011-05-06
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Publication No.: US08410486B2Publication Date: 2013-04-02
- Inventor: Sachiaki Tezuka , Yasuhiro Jinbo , Toshinari Sasaki , Hidekazu Miyairi
- Applicant: Sachiaki Tezuka , Yasuhiro Jinbo , Toshinari Sasaki , Hidekazu Miyairi
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Labortory Co., Ltd.
- Current Assignee: Semiconductor Energy Labortory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2010-112281 20100514
- Main IPC: H01L29/10
- IPC: H01L29/10

Abstract:
A method for manufacturing a semiconductor device having favorable electric characteristics with high productivity is provided. A first microcrystalline semiconductor film is formed over an oxide insulating film under a first condition that mixed phase grains with high crystallinity are formed at a low particle density. After that, a second microcrystalline semiconductor film is stacked over the first microcrystalline semiconductor film under a second condition that a space between the mixed phase grains are filled by the crystal growth of the mixed phase grains of the first microcrystalline semiconductor film.
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