Invention Grant
- Patent Title: Semiconductor light emitting device substrate strips and packaged semiconductor light emitting devices
- Patent Title (中): 半导体发光器件衬底条和封装的半导体发光器件
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Application No.: US13253657Application Date: 2011-10-05
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Publication No.: US08410491B2Publication Date: 2013-04-02
- Inventor: Ban P. Loh , Nicholas W. Madendorp, Jr.
- Applicant: Ban P. Loh , Nicholas W. Madendorp, Jr.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec, PA
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L31/12 ; H01L33/00
Abstract:
Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.
Public/Granted literature
- US20120025254A1 SEMICONDUCTOR LIGHT EMITTING DEVICE SUBSTRATE STRIPS AND PACKAGED SEMICONDUCTOR LIGHT EMITTING DEVICES Public/Granted day:2012-02-02
Information query
IPC分类:
