Invention Grant
- Patent Title: Light emitting diode coating method
- Patent Title (中): 发光二极管涂层方法
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Application No.: US12811794Application Date: 2009-01-06
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Publication No.: US08410517B2Publication Date: 2013-04-02
- Inventor: Sunghoon Kwon , Euijoon Yoon , Wook Park
- Applicant: Sunghoon Kwon , Euijoon Yoon , Wook Park
- Applicant Address: KR Seoul
- Assignee: SNU R&DB Foundation
- Current Assignee: SNU R&DB Foundation
- Current Assignee Address: KR Seoul
- Agency: Sherr & Jiang, PLLC
- Priority: KR10-2008-0001861 20080107
- International Application: PCT/KR2009/000038 WO 20090106
- International Announcement: WO2009/088198 WO 20090716
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
Provided is a light emitting diode (hereinafter, referred to as an LED) coating method, and more particularly, an LED coating method that can be used to coat a phosphor, a molding, etc., on an LED.The LED coating method includes (a) preparing a substrate and a plurality of LEDs arranged on the substrate; (b) applying a photoresist onto the substrate and the plurality of LEDs; and (c) selectively exposing the photoresist to light to form a first coating on surfaces of the plurality of LEDs. Here, the first coating is formed by curing the photoresist.
Public/Granted literature
- US20100276716A1 LIGHT EMITTING DIODE COATING METHOD Public/Granted day:2010-11-04
Information query
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