Invention Grant
- Patent Title: Group III nitride semiconductor device and epitaxial substrate
- Patent Title (中): III族氮化物半导体器件和外延衬底
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Application No.: US11569500Application Date: 2006-03-06
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Publication No.: US08410524B2Publication Date: 2013-04-02
- Inventor: Tatsuya Tanabe , Kouhei Miura , Makoto Kiyama , Takashi Sakurada
- Applicant: Tatsuya Tanabe , Kouhei Miura , Makoto Kiyama , Takashi Sakurada
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agent James W. Judge
- Priority: JP2005-084378 20050323; JP2006-019473 20060127
- International Application: PCT/JP2006/304262 WO 20060306
- International Announcement: WO2006/100897 WO 20060928
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Affords Group III nitride semiconductor devices in which the leakage current from the Schottky electrode can be reduced. In a high electron mobility transistor 11, a supporting substrate 13 is composed of AlN, AlGaN, or GaN, specifically. An AlYGa1−YN epitaxial layer 15 has a full-width-at-half maximum of (0002) plane XRD of 150 sec or less. A GaN epitaxial layer 17 is provided between the gallium nitride supporting substrate and the AlYGa1−YN epitaxial layer (0
Public/Granted literature
- US20090189186A1 Group III Nitride Semiconductor Device and Epitaxial Substrate Public/Granted day:2009-07-30
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