Invention Grant
- Patent Title: Compound semiconductor substrate and device therewith
- Patent Title (中): 复合半导体衬底及其装置
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Application No.: US12619110Application Date: 2009-11-16
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Publication No.: US08410525B2Publication Date: 2013-04-02
- Inventor: Ken Sato
- Applicant: Ken Sato
- Applicant Address: JP Niiza-shi
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Niiza-shi
- Agency: Oblon, Spival, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-295526 20081119
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device is formed on a semiconductor substrate, which is comprised of: a base substrate; and a multilayer being formed on the base substrate and having a surface serving for an interface with the semiconductor device, the multilayer including alternating layers of a first compound semiconductor and a second compound semiconductor materially distinguishable from the first compound semiconductor, one selected from the group consisting of the first compound semiconductor and the second compound semiconductor being doped with one selected from the group consisting of carbon and transition elements.
Public/Granted literature
- US20100123169A1 COMPOUND SEMICONDUCTOR SUBSTRATE AND DEVICE THEREWITH Public/Granted day:2010-05-20
Information query
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