Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12957231Application Date: 2010-11-30
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Publication No.: US08410547B2Publication Date: 2013-04-02
- Inventor: Heung-Jae Cho , Hong-Seon Yang , Se-Aug Jang
- Applicant: Heung-Jae Cho , Hong-Seon Yang , Se-Aug Jang
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: KR10-2007-0045065 20070509
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes a substrate having a recess in an area where a gate is to be formed, spacers formed over sidewalls of the recess, and a first gate electrode filling in the recess. The spacers include material having the first work function or insulation material. The first gate electrode includes material having a second work function, wherein the second work function is higher than that of the spacers.
Public/Granted literature
- US20110068393A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2011-03-24
Information query
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